According to Commercial Times of Taiwan, TSMC (TSM.US) plans to increase the OEM price of its 3nm wafers by more than 5%, and the price quoted for advanced packaging next year is also about 10% to 20% higher. According to the report, Apple (AAPL.US) , NVIDIA (NVDA.US) and other 5 major customers have booked all capacity until 2026.
Sources quoted in the article revealed that 3nm orders were strong in 2H24, and capacity utilisation is close to full and will be extended to 2025. The demand for advanced packaging capacity will continue to exceed supply until 2025.
The article also pointed out that TSMC's advanced packaging plant at Zhunan has become Taiwan's largest base for CoWoS manufacturing since its opening a year ago, with CoWoS monthly production capacity expected to increase from 17,000 to 33,000 pieces in 3Q24.
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